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SMD Type Reflective Photo Sensor Subminiature Photointerrupter
Description
The MIR-3307-TC11 consists of a Gallium Arsenide infrared emitting diode and a NPN silicon phototransistor built in a black plastic housing. It is a reflective subminiature photointerrupter.
MIR-3307-TC11
Unit: mm
Package Dimensions
Features
Compact and thin MIR-3307-TC11 : Compact DIP, SMD type Optimum detecting diatance : 0.8 - 1.0 mm Wavelength : 940nm Visible light cut-off type
NOTE: (1).Tolerance:0.2mm (2). ( ) Reference dimensions
Item Lead Material Mold Material
Content The Cu System Inner: Epoxy Resin Outer:PPA
Absolute Maximum Ratings
@ TA=25oC
Parameter Continuous Forward Current INPUT Reverse Voltage Power Dissipation
Collector-emitter breakdown voltage
Symbol IF VR Pad V(BR)CEO V(BR)ECO PC PTOT Topr Tstg
Minimum Rating Maximum Rating 30 5 o
Unit mA V mW V V mW mW
50 5 80 75 100 -40 C to + 85 C -40oC to + 85oC
o
OUTPUT Emitter-Collector breakdown voltage Collector power dissipation Total power dissipation Operating Temperature Range Storage Temperature Range
Lead Soldering Temperature (minimum 1.6mm from body) at 300 oC within 2 sec
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Optical-Electrical Characteristics
Parameter Forward Voltage Input Reverse Current Capacitance Output Collector Dark Current Capacitance
*1
@ TA=25oC
symbol VF IR Co Iceo CCE Ic tr tf ILEAK VCE(set)
Min. 45 -
Typ. 1.2 25 10 110 20 20 -
Max. 1.4 10 100 360 100 100 0.1 0.4
Unit. V A pF nA pF A S S A V
Test Conditions IF =20mA VR =3V VR =0V, f=1MHz Vce =20V VCE =5V, f=1MHz IF =4mA, Vce =3V Ic=100A, Vce =2V RL =1k, d =1mm IF =4mA, Vce =3V IF =20mA, Ic =0.1mA
Collector Current
Response Time (RISE) Transfer ChaResponse Time (FALL) racteristics *2 Leak Current Saturation Voltage
*2 WITHOUT REFLECTIVE OBJECT.
*1 THE CONDITION AND ARRANGEMENT OF THE REFLECTIVE OBJECT ARE SHOWN AS FOLLOWING .
TEST CONDITION AND ARRANGEMENT FOR COLLECTOR CURRENT
Al refletive Surface 1 mm-thick glass Device
Typical Optical-Electrical Characteristic Curves
Forward Current IF (mA) Power Dissipation (mW)
60 50 40 30 20 10 0 -25 0 25 50 75 100 120 100 80 60 40 20 0 -25 0 25 50 75 100 PTOT Pad , PC
Ambient Temperature TA (oC) Fig.1 forward Current VS. Ambient Temperature Forward Current IF (mA) Collector Current Ic (A)
50 40 30 20 10 0 0.0 0.5 1.0 1.5 600 500 400 300 200 100 0 0
Ambient Temperature TA ( oC ) Fig.2 Power Dissipation vs. Ambient Temperature
Vce=5V Ta=25oC
5
10
15
20
Forward Voltage VF (V) Fig.3 Forward Current VS Forward Voltage
Forward Current IF (mA) Fig.4 Collector Current vs. Forward Current
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Typical Optical-Electrical Characteristic Curves
Collector Current Ic (A)
350 300 250 200 150 100 50 0 0 2 4 6 8 10 12
1mA
Relative Collector Current (%)
Ta=25oC IF=10mA 4mA
120 100 80 60 40 20 0 -25 0 25 50 75 100
Collector-Emitter Voltage Vce (V) Fig.5 Collector Current vs. Vce Collector Dark Current ICEO
10-6 10
-7
Ambient Temperature TA (oC) Fig.6 Relative Collector Current VS.
100
Response Time (s)
VCE=10V
tr tr td
10 1 0.1 0.01
10-8 10-9 10-10 0 25 50 75 100
ts
VCE=2V IC=100A T a=25oC
0.1
1
10
Ambient Temperature TA (oC) Fig.7 Collector Dark Current vs. Ambient Temperature Relative Collector Current (%) Relative Sensitivity (%)
100 80 60 40 20 0 700 800 900 1000 1100 1200 Ta=25oC 120 100 80 60 40 20 0 0 1
Load Resistance Rt (K) Fig.8 Response Time vs. Load Resistance
IF=4mA VCE=5V T A=25oC
2
3
4
5
6
7
8
9 10
Wavelength (nm) Fig.9 Spectral Sensitivity (Detecting side)
Distance (mm) Fig.10 Relative Collector Current vs. Distance between MIR-3307 and Card
Test Circuit for Response Time
Vcc Input RD RL Input
Output Output 10% td tr 90% tf
ts
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Reliability Test Item
Test Item Description and Test Condition Evaluates resistance of the device when operated at electrical stress Ta=under room temperature Test Time=1000hrs (-24hrs,+72hrs) Evaluates moisture resistance of the device when stored for a long term at high temperature and high humidityTa=855 oC Rh=855%RhTest Time=1000hrs (-24hrs,+72hrs) Evaluates device durability for long term storage in high temperature Ta=105 oC Test Time=1000hrs(-24hrs,+72hrs) Evaluates device durability for long term storage in low temperature Ta=-55 oC Test Time=1000hrs(-24hrs,+72hrs) Reference Standard MIL-STD-750:1026 MIL-STD-883:1005 JIS C 7021:B-1 Judgement
Operation Life
ACCEPT: Power Decay <30%
High Temperature High Humidity
MIL-STD-202:103B JIS C 7021:B-11
ACCEPT: None is OPEN/SHORT ACCEPT: None is OPEN/SHORT ACCEPT: None is OPEN/SHORT ACCEPT: None is OPEN/SHORT
High Temperature Storage Low Temperature Storage
MIL-STD-883:1008 JIS C 7021:B-10
JIS C 7021:B-12 MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS C 7021:A-4
Evaluates resistance of device at thermal stresses or expansion and contraction Temperature Cycling 105oC ~ 25 oC ~ -55 oC ~ 25oC 30min 5min 30min 5min 20 Cycles
Thermal Shock
Evaluates device's structure and mechanical resistance when suddenly exposed at severe MIL-STD-202:107D changes MIL-STD-750:1051 o o MIL-STD-883:1011 105 C ~ -55 C 10min 10min 10 Cycles MIL-STD-202:210A MIL-STD-750:2031 JIS C 7021:A-1
ACCEPT: None is OPEN/SHORT
Reflow Soldering Reflow process : Condition is as follow Heat Resistance Test page. Less than 2 time.
ACCEPT: None is OPEN/SHORT
Solderability
Evaluates solderability on leads of device T.Sol=230oC Dwell Time=5 sec Phase1:110oC, 85%RH, 1.242kgf/cm2 Phase2:130oC, 85%RH,2.714kgf/cm2 Distance of Dropping : 1 m Drop the Device on the Maple Board 3 Times
MIL-STD-202:208D ACCEPT: MIL-STD-750:2026 95% soldering areaon MIL-STD-883:2003 the lead frame JIS C 7021:A-2 ACCEPT: None is OPEN/SHORT ACCEPT: None is OPEN/SHORT
PresureCooker Test
Drop Test
-
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
RECOMMENDED SOLDERING CONDITION
1. Reflow Soldering. 5 sec. MAX soldering time 240 oC MAX + 5 oC /sec. MAX - 5 oC /sec. MAX
160+10 oC
90 - 120 sec Preheating
1.a 1.b
The above temp. profile shall be at the surface of LED resin. Number of reflow process should be less than 2 times.If the second reflow process is performed, intervals between the first and the second process should be as short as possible to prevent moisture absorption from LED resin. Cooling process to normal temp. is required between the first and the second reflow process. Temp. fluctuation to LED at pre-heat process should be minimized. ( less than 6 oC )
1.c
2. Dip Soldering.
2.a. Preheat temp. for soldering : 120 - 150 C, 60 - 120 sec. 2.b. Soldering temp.: Temp. of soldering pot 300 oC Max and soldering time less than 2 sec. 2.c. Number of dip soldering process must be less than 2 times and the process is performed in sequrence. Cooling process to normal temp. will be required between the first and the second soldering process.
o
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Tape Dimensions
Unit:mm Tape Material: PET Symbol A B C D E F G H T t Dimension 3.50+0.1 5.55+0.1 8.00+0.2 4.00+0.1 1.75+0.1 5.50+0.1 1.50+0.1,-0 12.00+0.3 1.95+0.1 0.25+0.1,-0.05
REEL Dimensions
Reel Material : PS Symbol A B C D W1 W2 Dimension 180.0+0,-3 60.0+1,-0 13.0+0.2 2.0+0.5 13.0+0.3 15.4+1.0
Quantity : 1000pcs
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Taping Construction
Pulling direction
1. The sproket holes shall be on the left side against the pull-out direction. 2.The space of more than 20 pitches shall be provided on each front of tape mounting. 3.The space of more than 40 mm shall be provided on each rear of tape mounting. 4.The leader of more than 400 mm by the cover tape shall be provided at the pull-out start portion.
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Taping Mechanical characteristics and specifications
1. Peeling strength of cover tape : (1). F=0.2~0.7N(20~70gf)(measure by tension gage) (2). Tape should not be burst by peeling. 2. Specifications : (1). When the tape is bent to radius 30 mm, products do not fall down from the tape and tape doesn't get any gamage. (2). During the peeling, products do not fix to cover tape. (3). The product which was enclossed in reverse direction or with back side up should be count as 0pcs/reel. The number of dropped parts should be 0.1% reel.
Unity Opto Technology Co., Ltd.
11/06/2003
MIR-3307-TC11
Tolerance 10 mm H : 13 mm L : 180 mm
PCS/Reel L H Al laminate bag:1 Reel H : 190 mm L : 190 mm W : 75 mm Label H PCS/INNER BOX L W H : 215 mm L : 415 mm W : 400 mm H
1000pcs
4 REELS/INNER BOX
4000pcs
10 INNER BOXES/OUTER BOX
Label
W L PCS/OUTER BOX 40000pcs
PACKAGE LABEL
MIR-3307-TC11
Unity Opto Technology Co., Ltd.
11/06/2003

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